Feature |
Benefit |
Feature Function |
FeatureFunktionBenefit Figure of Merit Z
of the semiconductor material |
higher cooling capacity by less current |
2,8 bis 3,0 x 10-3 x K -1 |
Antidiffusion Barriers |
very long range durability |
Solder architecture |
Thermal Cycling Stability |
very long range durability |
modified design patented technology |
High Quality of Semicunductor |
any junction among each other |
constant resistance |
Flatness and Parallel Variance Accuracy |
High Thermal Efficiency |
better than +- 0,02 mm |
RoHS |
Leadfree modules |
Compliant with the European Directive 2002/95/EC |
Current Repeatability Batch
for batch the same values and tolerances |
application reliability |
AQL 0,65 |
Mechanical Resistance |
less mechanical fail |
use of high quality material |
Thermal Resistance |
longer durability |
cycling reliability |
Protection against Corrosion |
no corrosion happens |
internal and external sealing |
Dimensional Accuracy |
Assembling Reliability |
better than +/- 0,2 mm |
High Standard-Temperature Range |
high thermal load
|
150 °C / 183 °C m.p.t. |
High Temperature Range |
enhanced thermal load |
200 °C / 230 °C m.t.p |
ISO 9001 Certificate |
high reliability |
Zero Defect Operation |